Pyralux®

Pyralux®
The DuPont Flexible Materials group develops, manufactures and markets flexible, solderable, metal clad laminates, coverlays, and bonding adhesives for the fabrication of thin, solderable, high density electrical interconnects. These are used to make circuitry for single and double-sided, multilayer flex and rigid-flex applications.

Pyralux® AC:
 all polyimide laminate is a single-sided construction of polyimide film on copper foil(2 Layers). It is ideal for use in applications that require thin, light, and high-density circuitry along with chip-on-flex attachment.
Pyralux® AX:
 polyimide laminate is a double-sided construction of polyimide film on copper foil(2 Layers). It is ideal for use in applications that require thin, light, and high-density circuitry along with chip-on-flex attachment.
Pyralux® FR:
 acrylic copper clads, coverlays and bonding adhesives are low-cost, UL 94 VTM-0 recognized and used to make commercial V-0 recognized flexible printed circuits. (3 Layers)
Pyralux® LF:
 has a proven record of consistency and dependability and is still the industry standard for manufacturing Class 3 flexible and rigid-flex printed circuits.
(3 Layers)
Pyralux®AT:
 AT double-sided, copper-clad laminate is an all-polyimide composite of polyimide casted on copper foil. This material system is ideal for multilayer FPC and LCD Module Circuit applications.
Pyralux® HXS:
 Pyralux ® HX coverlay is a halogen free coverlay. Pyralux® HX coverlay composites are constructed of DuPont Kapton® polyimide film, coated on one side with a B-staged modified epoxy adhesive.